MediaTek has announced the Dimensity 8000 and 8100 chipsets: Earlier this year, MediaTek’s main specs’ new 8000 series 5G chips were leaked.
This came after the Dimensity 9000 chipset was released late last year. MediaTek has now made official that the Dimensity 8000 chip series, which includes the Dimensity 8000 and the Dimensity 8100 5G chipsets, is out.
In the future, these new MediaTek chipsets will power a lot of high-end 5G phones that people will buy. So, let’s see what they have to offer.
MediaTek has announced its Dimensity 8000 5G chipsets.
The new Dimensity 8000 5G series is made by TSMC and has an octa-core design.
For its new 5G chips, MediaTek says that it has put all of the technology from its previous Dimensity 9000 chip into them.
Indeed, the company says that the lower-end Dimensity 8000 chip could be seen as a “little brother” of the Dimensity 9000 chipset, the most powerful. In this way, you could say that the MediaTek Dimensity 8000 series is the little brother to our best-selling Dimensity 9000 chip.”
“It has features that are on par with the best phones on the market,” said CH Chen, the Deputy General Manager of MediaTek’s Wireless Communications Business unit.
Dimensity 8000 and Dimensity 8100 both have an ARM Mali-G610 GPU and MediaTek’s HyperEngine 5.0 gaming technologies built into them.
The Dimensity 8000 SoC has four ARM Cortex-A78 cores that can run at 2.75GHz.
The Dimensity 8100 chipset has four premium ARM Cortex-A78 cores that can run at 2.85GHz.
Both chips have 4x Cortex-A55 cores that can be clocked up to 2.0GHz on both of them.
There is also support for quad-channel LPDDR5 memory and UFS 3.1 storage, MediaTek’s 5th Generation APU 580, Wi-Fi 6E, and Bluetooth version 5.3, as well as a lot more.
The new Dimensity, 8000 series chipsets, can run up to 200 MP cameras and record 4K/60 HDR10+ video at 60 frames per second.
You can make more transparent HDR images and videos faster because it has an ISP that can process five gigapixels per second.
In addition, the new chipsets also come with the most recent noise-reduction and AI-based unblur technologies from MediaTek, which make low-light images look better.
They also have dual HDR video recording, which lets people take high-quality videos with both the front and back cameras simultaneously.
Plus, it has MediaTek’s 5G UltraSave 2.0 technology, which makes it more efficient when using 5G networks.
The Dimensity 8000 and 8100 5G phones are coming soon.
OnDimensity 8000 and 8100-powered phones will be coming out soon.
ePlus, Realme, Xiaomi, and Oppo are just a few companies making phones with the new MediaTek chipsets.
Dial me recently took to Weibo to say that the upcoming Realme GT Neo 3 will be powered by the new Dimensity 8100 chipset.
It will also be able to use its new 150W UltraDart Charging technology. A screenshot is below.
Besides this, OnePlus’s new device, which may be called the Nord 3, will also have the new 150W SuperVOOC fast-charging technology and the Dimensity 8100 chipset.
While that’s going on, Oppo has said that its K10 series will be the first to have the Dimensity 8000 chipset in them.
MediaTek has also added a new Dimensity 1300 chip to its line of 5G chips.
This chip has eight cores. One of the cores can run at up to 3GHz. There are three Cortex-A78 super cores, and there are 4 Cortex-A55 cores.
ARM’s Mali-G77 GPU and MediaTek’s APU 3.0 are also built into the chipset. It also has up to 200 MP cameras, HyperEngine 5.0 tech, and more.
This technology is compelling, expected to be used in a OnePlus Nord phone that may come out soon.
There will be many high-end phones with the Dimensity 8000 series chipsets in the first quarter of 2022.
We will let you know more about the event, so stay tuned. The Diemnsity chipsets are getting better all the time, so let us know what you think about them in the comments.